In a partnership first for the Cormack Innovation Awards, 2009 marked the opportunity for designing students to compete for a $5,000 Certificate in Packaging Scholarship inconjunction with the Australian Institute of Packaging.

In a natural fit with the University program that the Cormack Innovation Awards presents annually, the AIP Scholarship was an added incentive for students wishing to extend their career in the Packaging industry through further detailed education.

Both Cormack Packaging and the AIP are delighted to announce the 2009 receipient Sascha Dal Santo from the University of New South Wales. Sascha impressed the interview panel with her articulation, dedication to study and a clear insight into her future career aspirations and how the scholarship would enhance these further.

Sascha will be completing her twelve month scholarship with the AIP alongisde media and promotional commitments bringing a voice for student design into the AIP forum.

Special mention is also given to Grant Ovzinsky from the University of Technology Sydney who was awarded a highly commended for his outstanding essay entry and interview with judges.                

Pictured: 2009 AIP Scholarship receipient Sascha Dal Santo (centre), with AIP President Craig Wellman (left) and Cormack Packaging Managing Director Mathew Cormack (right)